Short answer: Hardik Kabaria says Vinci works with tier one semiconductor, electronics and foundry equipment companies on flagship memory and fabless programs, solving thermal problems from nanometer features to boards and edge devices. He cannot name customers.
Watch this answer from Episode 50 (starts at 16:00) · Episode 50 notes and transcript
From Episode 50: Physics Simulation for Chip Design Used to Take Days. This AI Does It in Seconds., starting at 16:00.
Jordan Metzner [16:00]: Yeah. Exactly. Okay. Just as we wrap this up, tell us a little bit about, know, maybe the customers you can tell us about who you're working with. Maybe you can't tell us some of your customers, but tell us a little bit about, like, who's using this kind of stuff. Obviously, there's a lot of chip manufacturers from, the big famous ones of the Nvidia's and the Intel's all the way down, you know. Obviously, we've we've got a ton of mix of amazing, CV chips and all different types of chip manufacturing in The United States and across the globe, actually.
Hardik Kabaria [16:23]: Yeah. I mean, so we work with semiconductor companies, electronics companies, equipment companies, the companies who make equipments that go in the foundry. So all the way from memory to fabless to foundry to equipment, a lot of these users for today as our tier one semiconductor hardware companies, so they are larger global enterprises. That is the place where we have started our go to market action. We are starting to engage with even the smaller and medium sized businesses, but so far, our focus has been on the large enterprises. We are attached to several programs, like we are attached to their flagship programs on the memory side and, fabless side. Of course, our customers are quite sensitive about the fact so that we cannot give you names, but that gives you an idea. The other way to think about us is if you have thermal problems can happen all the way the nanometer level features in a memory or a CPU or a GPU to the board level where now you integrate the ASICs or the CPU or the memory onto your board, that could be your consumer electronics to the racks, to now edge devices like you might have control system in your avionics, and now you care about putting more and more inference power so you have to think about how the thermal heat you are going to dissipate. You have thermal problems. We have a product powered by ground-up physics model that can enable you to have these type of
Jordan Metzner [17:57]: Yeah. I mean, think, no one's building chips who doesn't have thermal problems. I mean, heat dissipation is always a problem. And as you're mentioning, right, like, the edge devices, the less powerful devices are getting more compute capabilities, and then, therefore, you're gonna and, obviously, I mean, we have these problems of battery consumption and retention. No one wants an iPhone if it only lasts twenty minutes or something like that.
